Description

Product Introduction
This GE F31X170TBSADG1 is a high-density terminal and signal distribution board with integrated signal conditioning for GE’s excitation and power conversion control platforms. The “D” suffix indicates a high-density variant with integrated signal conditioning and expanded I/O capabilities. This board is designed for complex applications requiring both termination and signal conditioning in a single module.
The board provides high-density screw terminal connections for field devices, along with integrated signal conditioning for analog and digital signals. It serves as both a termination point and a signal conditioning interface, reducing the need for separate modules. The high-density design accommodates more signals in a compact footprint.
Key Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer | GE (General Electric) |
| Model Number | F31X170TBSADG1 |
| Product Type | Terminal Board with Signal Conditioning |
| Input Voltage | 24 VDC (from system power supply) |
| Terminations | High-density screw terminal connections |
| Signal Conditioning | Integrated voltage/current conversion, filtering |
| Signal Types | Analog, digital, and control signals |
| I/O | Expanded I/O channels |
| Labeling | Clearly marked terminal designations |
| Status Indication | LED indicators for power |
| Communication | Backplane connector |
| Operating Temperature | 0 to +55 °C |
| Storage Temperature | -40 to +85 °C |
| Board Dimensions | Standard 6U or custom form factor |
Key Selling Points & Differentiators
- High-Density Termination: More terminal points in a compact footprint for space-constrained applications.
- Integrated Signal Conditioning: Built-in signal conditioning reduces the need for separate modules.
- Expanded I/O: Additional I/O channels for complex system configurations.
- Quantified Testing Protocol: We test all terminations, signal conditioning functions, and I/O under simulated conditions.
- Warranty & Support: 2-year functional warranty with application support.
Frequently Asked Questions (FAQ)
Q1: What is the difference between the TBSADG1 and the TBSACG1?
A: The TBSACG1 provides termination with improved labeling. The TBSADG1 is a high-density variant with integrated signal conditioning and expanded I/O capabilities. The D variant is designed for more complex applications requiring signal conditioning.
Q2: What signal conditioning functions does the TBSADG1 include?
A: The board typically includes voltage/current conversion and filtering for analog signals. The specific conditioning functions depend on the configuration. Consult your system documentation for details.
Q3: Does the TBSADG1 reduce the need for separate conditioning modules?
A: Yes, the integrated signal conditioning reduces the need for separate conditioning modules, saving space and simplifying installation.
Q4: Can the TBSADG1 replace a standard TBSAAG1?
A: Yes, the board is mechanically and electrically compatible. The additional features provide enhanced capability without affecting existing functionality.
Q5: What is the lifecycle status of the TBSADG1?
A: This board is very rare. We have a very small batch of new surplus units. If your system requires the high-density termination and signal conditioning capabilities, we strongly recommend securing a spare. We do not expect to source more of this variant.
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