GE F31X170TBSADG1 Termination PCB | OEM New In Box

  • Model: F31X170TBSADG1
  • Brand: GE (General Electric)
  • Series: Excitation / Power Conversion Control Platform
  • Core Function: High-density terminal and signal distribution board with advanced signal conditioning for complex excitation and power conversion applications.
  • Product Type: Terminal Board with Signal Conditioning
  • Key Specs: High-density terminations | Integrated signal conditioning | Expanded I/O | Status indication
  • Condition: ⚠️ Discontinued – New Surplus / OEM stock. Rare high-density variant.
Manufacturer:

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Description

 

Product Introduction

This GE F31X170TBSADG1 is a high-density terminal and signal distribution board with integrated signal conditioning for GE’s excitation and power conversion control platforms. The “D” suffix indicates a high-density variant with integrated signal conditioning and expanded I/O capabilities. This board is designed for complex applications requiring both termination and signal conditioning in a single module.

The board provides high-density screw terminal connections for field devices, along with integrated signal conditioning for analog and digital signals. It serves as both a termination point and a signal conditioning interface, reducing the need for separate modules. The high-density design accommodates more signals in a compact footprint.

 

Key Technical Specifications

Parameter Value
Manufacturer GE (General Electric)
Model Number F31X170TBSADG1
Product Type Terminal Board with Signal Conditioning
Input Voltage 24 VDC (from system power supply)
Terminations High-density screw terminal connections
Signal Conditioning Integrated voltage/current conversion, filtering
Signal Types Analog, digital, and control signals
I/O Expanded I/O channels
Labeling Clearly marked terminal designations
Status Indication LED indicators for power
Communication Backplane connector
Operating Temperature 0 to +55 °C
Storage Temperature -40 to +85 °C
Board Dimensions Standard 6U or custom form factor

 

Key Selling Points & Differentiators

  • High-Density Termination: More terminal points in a compact footprint for space-constrained applications.
  • Integrated Signal Conditioning: Built-in signal conditioning reduces the need for separate modules.
  • Expanded I/O: Additional I/O channels for complex system configurations.
  • Quantified Testing Protocol: We test all terminations, signal conditioning functions, and I/O under simulated conditions.
  • Warranty & Support: 2-year functional warranty with application support.

 

Frequently Asked Questions (FAQ)

Q1: What is the difference between the TBSADG1 and the TBSACG1?

A: The TBSACG1 provides termination with improved labeling. The TBSADG1 is a high-density variant with integrated signal conditioning and expanded I/O capabilities. The D variant is designed for more complex applications requiring signal conditioning.

Q2: What signal conditioning functions does the TBSADG1 include?

A: The board typically includes voltage/current conversion and filtering for analog signals. The specific conditioning functions depend on the configuration. Consult your system documentation for details.

Q3: Does the TBSADG1 reduce the need for separate conditioning modules?

A: Yes, the integrated signal conditioning reduces the need for separate conditioning modules, saving space and simplifying installation.

Q4: Can the TBSADG1 replace a standard TBSAAG1?

A: Yes, the board is mechanically and electrically compatible. The additional features provide enhanced capability without affecting existing functionality.

Q5: What is the lifecycle status of the TBSADG1?

A: This board is very rare. We have a very small batch of new surplus units. If your system requires the high-density termination and signal conditioning capabilities, we strongly recommend securing a spare. We do not expect to source more of this variant.

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