DS3800HIOD1G1E | Mark V 64-Point I/O Rack Expansion Module

Description

Product Introduction

The DS3800HIOD1G1E is the extreme-environment, fully ruggedized I/O expansion board—conformal coating, 5A fusing on both banks, and an operating temperature range of -40°C to +85°C. This board provides 64 additional I/O points, making it suitable for large expansions in the harshest conditions. The conformal coating protects the PCB from moisture, dust, and chemicals, while the 5A fuses provide maximum headroom for expansion modules with high current requirements. The extended temperature range ensures reliable operation in arctic, desert, and un-conditioned outdoor installations.

We’ve used the HIOD1G1E in a desert solar plant where daytime temperatures exceeded 50°C and nighttime temperatures dropped to near freezing. The board’s extended temperature range and conformal coating ensured reliable operation through the extreme temperature swings, and the 64 I/O point capacity allowed us to add all the required I/O points without multiple expansion boards. The board integrated seamlessly with the main controller, and the expansion was completed without any issues.

Key Technical Specifications

Compatible Replacement Models

Frequently Asked Questions (FAQ)

Q: What’s the advantage of the conformal coating on the 1G1E?
A: Conformal coating is a thin polymeric film applied to the PCB that protects against moisture, dust, chemicals, and temperature extremes. The “1G” suffix indicates the board is conformal-coated, which is essential for offshore, desert, or high-humidity installations where corrosion and contamination can cause premature board failure.

Q: Why does the HIOD1G1E have 5A fuses on both banks?
A: The 5A fuses provide maximum headroom for expansion modules with high current requirements. This is particularly useful when the expansion backplane includes output modules driving large solenoids or contactors, or when cable runs are long and capacitance causes inrush currents. The 5A rating is the highest available for expansion boards and is the standard for extreme-environment variants.

Q: What’s the difference between the HIOD1G1E and the HIOB1H1G?
A: The HIOD1G1E has an extended operating temperature range of -40°C to +85°C and conformal coating, making it suitable for the harshest environments. The HIOB1H1G has a -20°C to +65°C range and uses a 50-pin DIN connector instead of terminal blocks. Both have 64 I/O points and 5A fusing. The HIOD is for extreme temperature applications, while the HIOB is for high-vibration applications.

Q: How many I/O points can the HIOD1G1E support?
A: The HIOD1G1E supports up to 64 additional I/O points. This includes both analog and discrete I/O modules. If you need more than 64 points, you can use multiple HIOD boards, or combine HIOD and HIOB boards to achieve the required capacity.

Q: Does the HIOD1G1E require additional power?
A: The HIOD1G1E draws power from the Mark V backplane. It does not require a separate power supply. The additional I/O modules connected to the expansion backplane will also draw power from the system’s power supply. Check your total power budget when adding expansion boards.

Q: Can I use the HIOD1G1E with all Mark V I/O modules?
A: Yes, the HIOD1G1E is compatible with all Mark V I/O modules, including analog, discrete, frequency, and counter modules. The board provides the backplane interface for the modules to communicate with the main controller.

Q: What’s the backplane current draw of the HIOD1G1E?
A: The HIOD1G1E draws 1.0A from the 5V backplane rail. The Mark V power supply is rated at 6A on the 5V rail, so the HIOD1G1E is within the limit. If your rack has multiple HIOD boards, check your total backplane current. We recommend keeping total backplane current below 5.5A for margin. The extreme temperature range does not affect the current draw.

GE DS200UPLAF1CAB
GE DS200UPLAF1CAC
GE DS200UPLAG1B