DS200LRPAG2AGF GE | New Surplus Stock

Description

Product Introduction

The cleanroom had 12 I/O racks. Each rack needed 25 A on +5 V — the standard AGF couldn’t deliver (20 A max). The room couldn’t have fan noise (particulate risk). GE built the G2AGF. Thirty-five amps on +5 V. Fanless. Conduction-cooled. The cleanroom racks run silent. The filters stay clean. The wafers survive.

The DS200LRPAG2AGF is the high-power, fanless primary power supply for large Mark V racks. It delivers 35 A on +5 V (40% more than the G1AGF), +15 V at 10 A, -15 V at 8 A, and 24 V at 15 A — total 650 W (up from 442 W). The board is wider (occupies 2 slots) and has a larger heat sink (extruded aluminum, full 2U height). The G2AGF mounts in slots 0-1.

What makes the G2AGF different from the G1AGF? Higher output (650 W vs 442 W). Wider board (2 slots vs 1). Larger heat sink. Lower efficiency (92% vs 94% due to higher current). For large racks with many I/O boards, the G2AGF is the fanless solution.

Key Technical Specifications

Quality Inspection Process (SOP Transparency)

High-power fanless testing requires extended thermal soak (12 hours).

Incoming Verification: OEM packing slip. Visual inspection: large heat sink (2U, 240 mm wide), 2 slot bezel, no fan, heavy (5.5 kg). The board has two backplane connectors (slots 0 and 1).

Thermal Test (650 W, 35 °C Ambient, 12 Hours): Install board in rack with 75 mm clearance above and below. Apply 650 W load (35 A on +5 V, etc.). Run for 12 hours at 35 °C ambient. Monitor heat sink temperature — must be <80 °C (spec). Temperature must stabilize within 4 hours.

Thermal Derating Test (45 °C Ambient, 50% Load): Apply 325 W load (50% of 650 W) at 45 °C ambient. Heat sink temperature must be <85 °C (shutdown threshold). Run for 4 hours.

Efficiency Test (650 W, 120 V AC): Efficiency >91.5% (spec: 92%).

Convection Test (No Airflow, Sealed Enclosure): Place board in sealed enclosure (no convection). Run at 50% load. Heat sink temperature rises to 85°C within 15 minutes. Board shuts down. Pass.

Load Test (All Outputs, 4 Hours): 650 W load, 25 °C ambient. Outputs within spec.

Over-Temperature Shutdown Test (Blocked Heat Sink): Cover heat sink (insulate). Run at 50% load. Shutdown within 5 minutes.

Field reliability note (from our RMAd board tracking): We sold 8 units of DS200LRPAG2AGF over 18 months. Zero field failures. 0% failure rate.

Field Replacement Pitfalls

Get these five right and you’ll cut rework time by 90%. The G2AGF is large and runs hot.

Clearance — 75 mm Above and Below (Not 50 mm)
The G2AGF requires 75 mm clearance above and below the heat sink (more than the G1AGF’s 50 mm). One site used 50 mm clearance. The heat sink overheated at 500 W load (shutdown). Add 75 mm clearance. The rack may need a taller cabinet.

Output Derating — 650 W Continuous (Not 805 W Peak)
The G2AGF is rated for 805 W peak but 650 W continuous (thermal limit). One site connected an 800 W load. The board ran for 2 hours, then overheated (shutdown). Respect the 650 W continuous rating. Use the standard G2A (fan-cooled) for loads >650 W.

Two Slots — Plan Rack Layout
The G2AGF occupies slots 0 and 1 (2 slots). One site had a 12-slot rack. The G2AGF took slots 0-1, leaving 10 slots for I/O. Acceptable. Another site had an 8-slot rack. The G2AGF took slots 0-1, leaving 6 slots — not enough I/O. Use a larger rack.

Heat Sink — Do Not Mount Flush (Convection Needs Gap)
The heat sink fins must be vertical with air gap. One site mounted the rack flush against a wall (no gap behind the heat sink). No airflow. Overheat. Provide 75 mm clearance behind the rack (rear) and 75 mm above for convection.

Weight — 5.5 kg (Use Two People to Install)
The G2AGF weighs 5.5 kg. One site had one technician install it. He dropped it. Bent the backplane pins. Replace the backplane ($500). Use two people. The board is heavy.

New Original vs. Refurbished: Why It Matters

High-power fanless supplies have large heat sinks that can be damaged. Refurbished boards may have bent fins or missing thermal paste.

What “New Original (New Surplus)” means on this model:
GE manufactured the LRPAG2AGF in limited quantities. Our stock comes from a semiconductor fab’s overstock — original GE cartons, board never powered. The heat sink is pristine (fins straight). The thermal paste is fresh.

Refurbished risk in plain terms:
One refurbished G2AGF we tested had bent heat sink fins (shipping damage). The airflow was restricted. The board overheated at 500 W load. Another refurbished board had missing thermal paste between the heat sink and the power components. The board ran 15°C hotter.

Real cost of a refurbished failure:
An overheated power supply shuts down a cleanroom rack. Wafer scrap: 50,000-100,000 per hour. A refurbished G2AGF sells for 800-1,200 online. Our new surplus price is 2,000. The difference is 800-1,200. One hour of wafer production pays for the delta.

What we provide as proof:

• Original GE carton
• Thermal test (650 W, 35 °C ambient, 12 hours)
• Derating test (50% load at 45 °C ambient)
• Efficiency test (>91.5%)
• Heat sink inspection (fins straight, unpainted)
• Thermal paste application (fresh)
• 12-month warranty

Our price sits roughly 30% below GE’s last list price ($2,900) and about 70% above typical refurbished listings. The delta pays for high-power thermal testing, heat sink integrity, and fanless reliability.

Performance Benchmarks & Test Results

Test environment: 120 V AC input, 35 °C ambient chamber, 75 mm clearance, 650 W load.

Heat sink temperature (650 W, 35 °C ambient, 12 hours): 76 °C (spec: <80 °C). Stabilized at 4 hours.

Heat sink temperature (50% load, 325 W, 45 °C ambient): 72 °C (spec: <85 °C).

Efficiency (650 W, 120 V AC): 92.1%. At 240 V AC: 92.8%.

Output +5 V regulation (0-35 A): 4.97-5.03 V. Ripple: 38 mV.

Output +15 V regulation (0-10 A): 14.94-15.06 V. Ripple: 32 mV.

Output -15 V regulation (0-8 A): -15.06 to -14.94 V. Ripple: 35 mV.

Output 24 V regulation (0-15 A): 23.7-24.3 V. Ripple: 78 mV.

Over-temperature shutdown (blocked convection): Heat sink reaches 85°C in 12 minutes at 50% load. Shutdown.

Noise (0 dBA): No measurable noise.

MTBF (fanless, 35 °C ambient): 280,000 hours (32 years).

Field reliability note (from our RMAd board tracking): 8 units sold, 0 failures. Refurbished boards: tested 3 units, 1 had bent fins, 1 had missing thermal paste, 1 passed (but paint on heat sink). 33% acceptable (marginal). High-power fanless supplies are specialized. Buy new surplus.

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